The Boring Box Inside AI Power Design Is Suddenly a Boardroom Topic
Magnetics, transformers, and cross-regional manufacturing are becoming strategic tools as power design grows more complex and customers demand tighter hardware-software integration.
Magnetics, transformers, and cross-regional manufacturing are becoming strategic tools as power design grows more complex and customers demand tighter hardware-software integration.
EVs, solar power, smart meters, and compact electronics are turning ferrite materials into a strategic supply-chain battleground rather than a quiet magnetic component category.
Miniaturized multilayer metal power inductors are becoming a quiet enabler for wearables, earbuds, and AI-heavy smartphones that need smaller boards without sacrificing current handling.
Integrated voltage regulators are pushing power conversion closer to AI processors, making multilayer metal power inductors and embedded MLCCs strategic tools for current density, thermal control, and…
Thin-film magnetic power inductors integrated into packaging point to a future where voltage regulation sits closer to processors and bulky external power components lose ground.
A piezoelectric-resonator DC/DC converter reached 96.2% peak efficiency from 48 V to 4.8 V, hinting at a future where some power inductors face a thin, vibrating alternative.
AI and GPU power delivery is moving closer to the silicon as thin-film magnetic inductors enter the package, challenging the old board-level playbook for high-current conversion.
The 1212 package size was considered too small to be practical just five years ago. Vishay’s IHLP1212-EZ-1Z series is rewriting what’s possible in space-constrained commercial electronics.
Vishay’s IHLP1212-EZ-1Z series packs 14.3A saturation current into a 3×3mm footprint smaller than a Tic-Tac, with no compromise on performance.