SiC Power Modules Have a New Favorite Capacitor Problem: Inductance
Ultra-low-inductance DC-link capacitors for SiC power electronics show how capacitor packaging and parasitics are becoming central to module performance.
Ultra-low-inductance DC-link capacitors for SiC power electronics show how capacitor packaging and parasitics are becoming central to module performance.
Murata’s mass production of compact high-capacitance automotive soft-termination MLCCs shows how electrified vehicles are forcing passive components to carry more performance in less PCB space.
SPICE-based ripple-current analysis gives power designers a practical way to see capacitor stress before heat, lifetime loss, and field failures show up in hardware.
Ripple current is a lifetime problem hiding inside power supplies, and SPICE-based FFT analysis gives engineers a practical way to estimate capacitor stress before heat wins.
AI servers are pushing high-end MLCC demand toward capacity limits, exposing how small passive components can become a serious constraint in the data-center hardware race.
AI accelerators are lifting silicon capacitors from a niche packaging detail into a premium supply-chain item tied to wafer capacity and long-term contracts.
A capacitive position-sensing approach using sensor-to-reference capacitance ratios highlights how simple analog building blocks can still deliver precise motion insight.
Modern electronics are raising the strategic value of capacitors as power density, reliability, and energy stability become everyday design constraints.
AI server power density is stretching high-end MLCC supply, pushing lead times to 16–20 weeks and creating openings for Taiwanese passive-component suppliers.
A roughly US$1.038 billion silicon-capacitor supply agreement for AI semiconductors highlights growing demand for ultra-thin, high-density capacitors near advanced chips.