被動元件綜合新聞

AI server demand is increasing pressure on high-end MLCC supply, pushing Taiwanese manufacturers to qualify alternative sources and creating order spillover opportunities across the capacitor supply c…

AI 伺服器需求推升高階 MLCC 採購壓力，台廠加速尋找替代料源並推動第二來源認證，帶動電容供應鏈訂單外溢機會。

Overvoltage protection is becoming a core power-design decision as dense systems rely on TVS diodes and MOV varistors to survive harsher electrical stress.

功率密度與應用環境同步升級，TVS 與 MOV 壓敏電阻讓過壓保護從配角變成電源架構的關鍵決策。

High-current chip ferrite beads above 10 A highlight how EMI suppression is becoming an early architecture choice in dense power designs.

高電流晶片磁珠承載超過 10 A，顯示 EMI 抑制已從設計後段補救，升級為高密度電源架構的核心考量。

Ultra-low-inductance DC-link capacitors for SiC power electronics show how capacitor packaging and parasitics are becoming central to module performance.

SiC 電力電子讓 DC-Link 電容的封裝、寄生電感與模組整合成為性能關鍵，電容不再只是容量規格競賽。

Bourns’ MH1608A high-current ferrite beads point to rising demand for compact EMI suppression in space-constrained automotive electronics.

MH1608A 高電流磁珠凸顯車用電子小型化下的 EMI 壓力，濾波元件正從補救配角變成平台設計要素。